DRIE
DRIE
Alcatel - AMS 100
RTNN
University of North Carolina
Chapel Hill Analytical and Nanofabrication Laboratory (CHANL)
- Etching
- Dry
- Deep Silicon (Bosch)
Description
The AMS 100 uses a highly anisotropic Bosch etch process to create deep, steep-sided holes and trenches in substrates. It utilizes an inductively coupled plasma (ICP) and fluorine gas chemistries to etch features typically in silicon, although we've etched other materials as well.
Maximum Substrate Size
6 inch